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6.152J Microelectronics Processing Technology (MIT) 6.152J Microelectronics Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology. This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | microelectronics | Microelectronics processing | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic | integrated circuits;vacuum;chemical vapor deposition;CVD;oxidation;diffusion;implantation;lithography;soft lithography;etching;sputtering;evaporation;interconnect;metallization;crystal growth;reliability;fabrication;processing;photolithography;physical vapor deposition;MOS;MOS capacitor;microcantilever;microfluidic | integrated circuits;vacuum;chemical vapor deposition;CVD;oxidation;diffusion;implantation;lithography;soft lithography;etching;sputtering;evaporation;interconnect;metallization;crystal growth;reliability;fabrication;processing;photolithography;physical vapor deposition;MOS;MOS capacitor;microcantilever;microfluidic | integrated circuits | integrated circuits | vacuum | vacuum | chemical vapor deposition | chemical vapor deposition | CVD | CVD | oxidation | oxidation | diffusion | diffusion | implantation | implantation | lithography | lithography | soft lithography | soft lithography | etching | etching | sputtering | sputtering | evaporation | evaporation | interconnect | interconnect | metallization | metallization | crystal growth | crystal growth | reliability | reliability | fabrication | fabrication | processing | processing | photolithography | photolithography | physical vapor deposition | physical vapor deposition | MOS | MOS | MOS capacitor | MOS capacitor | microcantilever | microcantilever | microfluidic | microfluidic | 6.152 | 6.152 | 3.155 | 3.155

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.152J Microelectronics Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic | integrated circuits;vacuum;chemical vapor deposition;CVD;oxidation;diffusion;implantation;lithography;soft lithography;etching;sputtering;evaporation;interconnect;metallization;crystal growth;reliability;fabrication;processing;photolithography;physical vapor deposition;MOS;MOS capacitor;microcantilever;microfluidic | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic | 6.152 | 3.155

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see https://ocw.mit.edu/terms/index.htm

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6.374 Analysis and Design of Digital Integrated Circuits (MIT) 6.374 Analysis and Design of Digital Integrated Circuits (MIT)

Description

6.374 examines the device and circuit level optimization of digital building blocks. Topics covered include: MOS device models including Deep Sub-Micron effects; circuit design styles for logic, arithmetic and sequential blocks; estimation and minimization of energy consumption; interconnect models and parasitics; device sizing and logical effort; timing issues (clock skew and jitter) and active clock distribution techniques; memory architectures, circuits (sense amplifiers) and devices; testing of integrated circuits. The course employs extensive use of circuit layout and SPICE in design projects and software labs. 6.374 examines the device and circuit level optimization of digital building blocks. Topics covered include: MOS device models including Deep Sub-Micron effects; circuit design styles for logic, arithmetic and sequential blocks; estimation and minimization of energy consumption; interconnect models and parasitics; device sizing and logical effort; timing issues (clock skew and jitter) and active clock distribution techniques; memory architectures, circuits (sense amplifiers) and devices; testing of integrated circuits. The course employs extensive use of circuit layout and SPICE in design projects and software labs.

Subjects

digital integrated circuit | device | circuit | digital | MOS | digital integrated circuit | device | circuit | digital | MOS | digital integrated circuit | digital integrated circuit | device | device | circuit | circuit | digital | digital | MOS | MOS | Deep Sub-Micron effects | Deep Sub-Micron effects | circuit design | circuit design | logic | logic | interconnect models; parasitics | interconnect models; parasitics | device sizing | device sizing | timing | timing | clock skew | clock skew | jitter; clock distribution techniques | jitter; clock distribution techniques | memory architectures | memory architectures | circuits | circuits | sense amplifiers | sense amplifiers | SPICE | SPICE | HSPICE | HSPICE | Magic | Magic | Nanosim | Nanosim | Avanwaves | Avanwaves | device level optimization | device level optimization | interconnect models | interconnect models | parasitics | parasitics | jitter | jitter | clock distribution techniques | clock distribution techniques | CMOS inverter | CMOS inverter | combinational logic | combinational logic | sequential circuits | sequential circuits

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.720J Integrated Microelectronic Devices (MIT) 6.720J Integrated Microelectronic Devices (MIT)

Description

6.720 examines the physics of microelectronic semiconductor devices for silicon integrated circuit applications. Topics covered include: semiconductor fundamentals, p-n junction, metal-oxide semiconductor structure, metal-semiconductor junction, MOS field-effect transistor, and bipolar junction transistor. The course emphasizes physical understanding of device operation through energy band diagrams and short-channel MOSFET device design. Issues in modern device scaling are also outlined. The course is worth 2 Engineering Design Points. Acknowledgments Prof. Jesús del Alamo would like to thank Prof. Harry Tuller for his support of and help in teaching the course. 6.720 examines the physics of microelectronic semiconductor devices for silicon integrated circuit applications. Topics covered include: semiconductor fundamentals, p-n junction, metal-oxide semiconductor structure, metal-semiconductor junction, MOS field-effect transistor, and bipolar junction transistor. The course emphasizes physical understanding of device operation through energy band diagrams and short-channel MOSFET device design. Issues in modern device scaling are also outlined. The course is worth 2 Engineering Design Points. Acknowledgments Prof. Jesús del Alamo would like to thank Prof. Harry Tuller for his support of and help in teaching the course.

Subjects

integrated microelectronic devices | integrated microelectronic devices | physics | physics | silicon | silicon | circuit | circuit | semiconductor | semiconductor | p-n junction | p-n junction | metal-oxide semiconductor structure | metal-oxide semiconductor structure | metal-semiconductor junction | metal-semiconductor junction | MOS field-effect transistor | MOS field-effect transistor | bipolar junction transistor | bipolar junction transistor | energy band diagram | energy band diagram | short-channel MOSFET | short-channel MOSFET | device characterization | device characterization | device design | device design

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.152J Micro/Nano Processing Technology (MIT) 6.152J Micro/Nano Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology. This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | microelectronics | Microelectronics processing | Microelectronics processing | integrated circuits | integrated circuits | vacuum | vacuum | chemical vapor deposition | chemical vapor deposition | CVD | CVD | oxidation | oxidation | diffusion | diffusion | implantation | implantation | lithography | lithography | soft lithography | soft lithography | etching | etching | sputtering | sputtering | evaporation | evaporation | interconnect | interconnect | metallization | metallization | crystal growth | crystal growth | reliability | reliability | fabrication | fabrication | processing | processing | photolithography | photolithography | physical vapor deposition | physical vapor deposition | MOS | MOS | MOS capacitor | MOS capacitor | microcantilever | microcantilever | microfluidic. | microfluidic.

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.720J Integrated Microelectronic Devices (MIT) 6.720J Integrated Microelectronic Devices (MIT)

Description

6.720 examines the physics of microelectronic semiconductor devices for silicon integrated circuit applications. Topics covered include: semiconductor fundamentals, p-n junction, metal-oxide semiconductor structure, metal-semiconductor junction, MOS field-effect transistor, and bipolar junction transistor. The course emphasizes physical understanding of device operation through energy band diagrams and short-channel MOSFET device design. Issues in modern device scaling are also outlined. The course is worth 2 Engineering Design Points. 6.720 examines the physics of microelectronic semiconductor devices for silicon integrated circuit applications. Topics covered include: semiconductor fundamentals, p-n junction, metal-oxide semiconductor structure, metal-semiconductor junction, MOS field-effect transistor, and bipolar junction transistor. The course emphasizes physical understanding of device operation through energy band diagrams and short-channel MOSFET device design. Issues in modern device scaling are also outlined. The course is worth 2 Engineering Design Points.

Subjects

integrated microelectronic devices | integrated microelectronic devices | physics | physics | silicon | silicon | circuit | circuit | semiconductor | semiconductor | p-n junction | p-n junction | metal-oxide semiconductor structure | metal-oxide semiconductor structure | metal-semiconductor junction | metal-semiconductor junction | MOS field-effect transistor | MOS field-effect transistor | bipolar junction transistor | bipolar junction transistor | energy band diagram | energy band diagram | short-channel MOSFET | short-channel MOSFET | device characterization | device characterization | device design | device design | 6.720 | 6.720 | 3.43 | 3.43

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.374 Analysis and Design of Digital Integrated Circuits (MIT)

Description

6.374 examines the device and circuit level optimization of digital building blocks. Topics covered include: MOS device models including Deep Sub-Micron effects; circuit design styles for logic, arithmetic and sequential blocks; estimation and minimization of energy consumption; interconnect models and parasitics; device sizing and logical effort; timing issues (clock skew and jitter) and active clock distribution techniques; memory architectures, circuits (sense amplifiers) and devices; testing of integrated circuits. The course employs extensive use of circuit layout and SPICE in design projects and software labs.

Subjects

digital integrated circuit | device | circuit | digital | MOS | digital integrated circuit | device | circuit | digital | MOS | Deep Sub-Micron effects | circuit design | logic | interconnect models; parasitics | device sizing | timing | clock skew | jitter; clock distribution techniques | memory architectures | circuits | sense amplifiers | SPICE | HSPICE | Magic | Nanosim | Avanwaves | device level optimization | interconnect models | parasitics | jitter | clock distribution techniques | CMOS inverter | combinational logic | sequential circuits

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see https://ocw.mit.edu/terms/index.htm

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6.374 Analysis and Design of Digital Integrated Circuits (MIT)

Description

6.374 examines the device and circuit level optimization of digital building blocks. Topics covered include: MOS device models including Deep Sub-Micron effects; circuit design styles for logic, arithmetic and sequential blocks; estimation and minimization of energy consumption; interconnect models and parasitics; device sizing and logical effort; timing issues (clock skew and jitter) and active clock distribution techniques; memory architectures, circuits (sense amplifiers) and devices; testing of integrated circuits. The course employs extensive use of circuit layout and SPICE in design projects and software labs.

Subjects

digital integrated circuit | device | circuit | digital | MOS | digital integrated circuit | device | circuit | digital | MOS | Deep Sub-Micron effects | circuit design | logic | interconnect models; parasitics | device sizing | timing | clock skew | jitter; clock distribution techniques | memory architectures | circuits | sense amplifiers | SPICE | HSPICE | Magic | Nanosim | Avanwaves | device level optimization | interconnect models | parasitics | jitter | clock distribution techniques | CMOS inverter | combinational logic | sequential circuits

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see https://ocw.mit.edu/terms/index.htm

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6.374 Analysis and Design of Digital Integrated Circuits (MIT)

Description

6.374 examines the device and circuit level optimization of digital building blocks. Topics covered include: MOS device models including Deep Sub-Micron effects; circuit design styles for logic, arithmetic and sequential blocks; estimation and minimization of energy consumption; interconnect models and parasitics; device sizing and logical effort; timing issues (clock skew and jitter) and active clock distribution techniques; memory architectures, circuits (sense amplifiers) and devices; testing of integrated circuits. The course employs extensive use of circuit layout and SPICE in design projects and software labs.

Subjects

digital integrated circuit | device | circuit | digital | MOS | digital integrated circuit | device | circuit | digital | MOS | Deep Sub-Micron effects | circuit design | logic | interconnect models; parasitics | device sizing | timing | clock skew | jitter; clock distribution techniques | memory architectures | circuits | sense amplifiers | SPICE | HSPICE | Magic | Nanosim | Avanwaves | device level optimization | interconnect models | parasitics | jitter | clock distribution techniques | CMOS inverter | combinational logic | sequential circuits

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see https://ocw.mit.edu/terms/index.htm

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6.152J Micro/Nano Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic.

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.152J Micro/Nano Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic.

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.152J Micro/Nano Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic.

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.152J Micro/Nano Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic.

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.152J Micro/Nano Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic.

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.301 Solid-State Circuits (MIT) 6.301 Solid-State Circuits (MIT)

Description

This course covers analog circuit analysis and design, focusing on the tools and methods necessary for the creative design of useful circuits using active devices. The class stresses insight and intuition, applied to the design of transistor circuits and the estimation of their performance. The course concentrates on circuits using the bipolar junction transistor, but the techniques that are studied can be equally applied to circuits using JFETs, MOSFETs, MESFETs, future exotic devices, or even vacuum tubes. This course covers analog circuit analysis and design, focusing on the tools and methods necessary for the creative design of useful circuits using active devices. The class stresses insight and intuition, applied to the design of transistor circuits and the estimation of their performance. The course concentrates on circuits using the bipolar junction transistor, but the techniques that are studied can be equally applied to circuits using JFETs, MOSFETs, MESFETs, future exotic devices, or even vacuum tubes.

Subjects

solid state circuits | solid state circuits | analog | analog | circuit | circuit | transistor | transistor | bipolar junction transistor | bipolar junction transistor | JFET | JFET | MOSFET | MOSFET | MESFET | MESFET | vacuum tubes | vacuum tubes | single-transistor common-emitter amplifier | single-transistor common-emitter amplifier | op amps | op amps | multipliers | multipliers | references | references | high speed logic | high speed logic | high-frequency analysis | high-frequency analysis | open-circuit time constants | open-circuit time constants | transimpedance amps | transimpedance amps | translinear circuits | translinear circuits | bandgap references | bandgap references | charge control model | charge control model

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.152J Micro/Nano Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic.

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.152J Micro/Nano Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic.

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.152J Micro/Nano Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic.

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.152J Micro/Nano Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic.

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.002 Circuits and Electronics (MIT) 6.002 Circuits and Electronics (MIT)

Description

6.002 introduces the fundamentals of the lumped circuit abstraction. Topics covered include: resistive elements and networks; independent and dependent sources; switches and MOS transistors; digital abstraction; amplifiers; energy storage elements; dynamics of first- and second-order networks; design in the time and frequency domains; and analog and digital circuits and applications. Design and lab exercises are also significant components of the course. 6.002 is worth 4 Engineering Design Points. 6.002 introduces the fundamentals of the lumped circuit abstraction. Topics covered include: resistive elements and networks; independent and dependent sources; switches and MOS transistors; digital abstraction; amplifiers; energy storage elements; dynamics of first- and second-order networks; design in the time and frequency domains; and analog and digital circuits and applications. Design and lab exercises are also significant components of the course. 6.002 is worth 4 Engineering Design Points.

Subjects

circuit | circuit | electronic | electronic | abstraction | abstraction | lumped circuit | lumped circuit | digital | digital | amplifier | amplifier | differential equations | differential equations | time behavior | time behavior | energy storage | energy storage | semiconductor diode | semiconductor diode | field-effect | field-effect | field-effect transistor | field-effect transistor | resistor | resistor | source | source | inductor | inductor | capacitor | capacitor | diode | diode | series-parallel reduction | series-parallel reduction | voltage | voltage | current divider | current divider | node method | node method | linearity | linearity | superposition | superposition | Thevenin-Norton equivalent | Thevenin-Norton equivalent | power flow | power flow | Boolean algebra | Boolean algebra | binary signal | binary signal | MOSFET | MOSFET | noise margin | noise margin | singularity functions | singularity functions | sinusoidal-steady-state | sinusoidal-steady-state | impedance | impedance | frequency response curves | frequency response curves | operational amplifier | operational amplifier | Op-Amp | Op-Amp | negative feedback | negative feedback | positive feedback | positive feedback

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.152J Micro/Nano Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic.

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.152J Micro/Nano Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic.

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.152J Micro/Nano Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic.

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.152J Micro/Nano Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic.

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see https://ocw.mit.edu/terms/index.htm

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6.152J Micro/Nano Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic.

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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