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6.152J Microelectronics Processing Technology (MIT) 6.152J Microelectronics Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology. This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | microelectronics | Microelectronics processing | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic | integrated circuits;vacuum;chemical vapor deposition;CVD;oxidation;diffusion;implantation;lithography;soft lithography;etching;sputtering;evaporation;interconnect;metallization;crystal growth;reliability;fabrication;processing;photolithography;physical vapor deposition;MOS;MOS capacitor;microcantilever;microfluidic | integrated circuits;vacuum;chemical vapor deposition;CVD;oxidation;diffusion;implantation;lithography;soft lithography;etching;sputtering;evaporation;interconnect;metallization;crystal growth;reliability;fabrication;processing;photolithography;physical vapor deposition;MOS;MOS capacitor;microcantilever;microfluidic | integrated circuits | integrated circuits | vacuum | vacuum | chemical vapor deposition | chemical vapor deposition | CVD | CVD | oxidation | oxidation | diffusion | diffusion | implantation | implantation | lithography | lithography | soft lithography | soft lithography | etching | etching | sputtering | sputtering | evaporation | evaporation | interconnect | interconnect | metallization | metallization | crystal growth | crystal growth | reliability | reliability | fabrication | fabrication | processing | processing | photolithography | photolithography | physical vapor deposition | physical vapor deposition | MOS | MOS | MOS capacitor | MOS capacitor | microcantilever | microcantilever | microfluidic | microfluidic | 6.152 | 6.152 | 3.155 | 3.155

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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TALAT Lecture 5201: Aluminium Surface Pretreatment

Description

This lecture gives an overview of the various pretreatment methods prior to surface treatment of aluminium; it aims at learning about the important parameters and the mechanisms causing surface alterations. Some knowledge of the surface properties, the metallurgy and the electrochemistry of aluminium and familiarity with the subject matter covered in TALAT This lectures 5101- 5105 is assumed.

Subjects

aluminium | aluminum | european aluminium association | eaa | talat | training in aluminium application technologies | training | metallurgy | technology | lecture | surface treatment | mechanical pretreatment | electropolishing | brytal process | alzak process | phosphoric acid process | chemical polishing | chemical cleaning | chemical etching | solvent cleaning | emulsion cleaning | vapour degreasing | etch cleaning solutions | matt etching | alkaline etching | acid etching | corematerials | ukoer | Engineering | H000

License

Attribution-Noncommercial-Share Alike 2.0 UK: England & Wales Attribution-Noncommercial-Share Alike 2.0 UK: England & Wales http://creativecommons.org/licenses/by-nc-sa/2.0/uk/ http://creativecommons.org/licenses/by-nc-sa/2.0/uk/

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TALAT Lecture 5201: Aluminium Surface Pretreatment

Description

This lecture gives an overview of the various pretreatment methods prior to surface treatment of aluminium; it aims at learning about the important parameters and the mechanisms causing surface alterations. Some knowledge of the surface properties, the metallurgy and the electrochemistry of aluminium and familiarity with the subject matter covered in TALAT This lectures 5101- 5105 is assumed.

Subjects

aluminium | aluminum | european aluminium association | EAA | Training in Aluminium Application Technologies | training | metallurgy | technology | lecture | surface treatment | mechanical pretreatment | electropolishing | Brytal process | Alzak process | phosphoric acid process | chemical polishing | chemical cleaning | chemical etching | solvent cleaning | emulsion cleaning | vapour degreasing | etch cleaning solutions | matt etching | alkaline etching | acid etching | corematerials | ukoer

License

http://creativecommons.org/licenses/by-nc-sa/2.0/uk/

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6.152J Microelectronics Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic | integrated circuits;vacuum;chemical vapor deposition;CVD;oxidation;diffusion;implantation;lithography;soft lithography;etching;sputtering;evaporation;interconnect;metallization;crystal growth;reliability;fabrication;processing;photolithography;physical vapor deposition;MOS;MOS capacitor;microcantilever;microfluidic | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic | 6.152 | 3.155

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see https://ocw.mit.edu/terms/index.htm

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2.000 How and Why Machines Work (MIT) 2.000 How and Why Machines Work (MIT)

Description

Subject studies how and why machines work, how they are conceived, how they are developed (drawn), and how they are utilized. Students learn from the hands-on experiences of taking things apart mentally and physically, drawing (sketching, 3D CAD) what they envision and observe, taking occasional field trips, and completing an individual term project (concept, creation, and presentation). Emphasis on understanding the physics and history of machines. Subject studies how and why machines work, how they are conceived, how they are developed (drawn), and how they are utilized. Students learn from the hands-on experiences of taking things apart mentally and physically, drawing (sketching, 3D CAD) what they envision and observe, taking occasional field trips, and completing an individual term project (concept, creation, and presentation). Emphasis on understanding the physics and history of machines.

Subjects

machines | machines | conceived | conceived | developed | developed | drawn | drawn | hands-on experience | hands-on experience | sketching | sketching | field trips | field trips | history | history

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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4.104 Architecture Studio: Intentions (MIT) 4.104 Architecture Studio: Intentions (MIT)

Description

This is the second undergraduate design studio. It introduces a full range of architectural ideas and issues through drawing exercises, analyses of precedents, and explored design methods. Students will develop design skills by conceptualizing and representing architectural ideas and making aesthetic judgments about building design. Discussions regarding architecture's role in mediating culture, nature and technology will help develop the students' architectural vocabulary. This is the second undergraduate design studio. It introduces a full range of architectural ideas and issues through drawing exercises, analyses of precedents, and explored design methods. Students will develop design skills by conceptualizing and representing architectural ideas and making aesthetic judgments about building design. Discussions regarding architecture's role in mediating culture, nature and technology will help develop the students' architectural vocabulary.

Subjects

architecture | architecture | introduction | introduction | design | design | public | public | private | private | structure | structure | material | material | tectonics | tectonics | sketching | sketching | drawing | drawing | perspective | perspective | rendering | rendering | space | space | light | light | MIT | MIT | visual arts | visual arts | artist habitation | artist habitation | dynamism | dynamism | intention creation | intention creation

License

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16.810 Engineering Design and Rapid Prototyping (MIT) 16.810 Engineering Design and Rapid Prototyping (MIT)

Description

Includes audio/video content: AV special element video. This course provides students with an opportunity to conceive, design and implement a product, using rapid prototyping methods and computer-aid tools. The first of two phases challenges each student team to meet a set of design requirements and constraints for a structural component. A course of iteration, fabrication, and validation completes this manual design cycle. During the second phase, each team conducts design optimization using structural analysis software, with their phase one prototype as a baseline. Acknowledgements This course is made possible thanks to a grant by the alumni sponsored Teaching and Education Enhancement Program (Class of '51 Fund for Excellence in Education, Class of '55 Fund for Excellence in Teaching, Includes audio/video content: AV special element video. This course provides students with an opportunity to conceive, design and implement a product, using rapid prototyping methods and computer-aid tools. The first of two phases challenges each student team to meet a set of design requirements and constraints for a structural component. A course of iteration, fabrication, and validation completes this manual design cycle. During the second phase, each team conducts design optimization using structural analysis software, with their phase one prototype as a baseline. Acknowledgements This course is made possible thanks to a grant by the alumni sponsored Teaching and Education Enhancement Program (Class of '51 Fund for Excellence in Education, Class of '55 Fund for Excellence in Teaching,

Subjects

engineering design | engineering design | rapid prototyping | rapid prototyping | manufacturing | manufacturing | testing | testing | system components | system components | complex structural parts | complex structural parts | hand sketching | hand sketching | CAD | CAD | CAD modeling | CAD modeling | CAE | CAE | CAE analysis | CAE analysis | CAM programming | CAM programming | CNC | CNC | CNC machining | CNC machining | computer aided design | computer aided design | computer aided | computer aided | structual testing | structual testing | multiobjective design | multiobjective design | optimization | optimization | computational methods | computational methods | tools | tools | design process | design process | design competition | design competition | active learning | active learning | hands-on | hands-on | human creativity | human creativity | holistic | holistic | solidworks | solidworks | finite element | finite element | FEM | FEM | FEM analysis | FEM analysis | COSMOS | COSMOS | omax | omax | presentation | presentation | CDIO | CDIO

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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4.104 Architectural Design: Intentions (MIT) 4.104 Architectural Design: Intentions (MIT)

Description

This is the second undergraduate design studio. It introduces a full range of architectural ideas and issues through drawing exercises, analyses of precedents, and explored design methods. Students will develop design skills by conceptualizing and representing architectural ideas and making aesthetic judgments about building design. Discussions regarding architecture's role in mediating culture, nature and technology will help develop the students' architectural vocabulary. This is the second undergraduate design studio. It introduces a full range of architectural ideas and issues through drawing exercises, analyses of precedents, and explored design methods. Students will develop design skills by conceptualizing and representing architectural ideas and making aesthetic judgments about building design. Discussions regarding architecture's role in mediating culture, nature and technology will help develop the students' architectural vocabulary.

Subjects

architecture | architecture | introduction | introduction | design | design | public | public | private | private | restroom | restroom | detention | detention | Cuba | Cuba | Guantanamo | Guantanamo | structure | structure | material | material | tectonics | tectonics | sketching | sketching | drawing | drawing | perspective | perspective | rendering | rendering | space | space | light | light

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.781J Submicrometer and Nanometer Technology (MIT) 6.781J Submicrometer and Nanometer Technology (MIT)

Description

Includes audio/video content: AV special element video. This course surveys techniques to fabricate and analyze submicron and nanometer structures, with applications. Optical and electron microscopy is reviewed. Additional topics that are covered include: surface characterization, preparation, and measurement techniques, resist technology, optical projection, interferometric, X-ray, ion, and electron lithography; Aqueous, ion, and plasma etching techniques; lift-off and electroplating; and ion implantation. Applications in microelectronics, microphotonics, information storage, and nanotechnology will also be explored.AcknowledgementsThe Instructors would like to thank Bob Barsotti, Bryan Cord, and Ben Wunsch for their work on the Atomic Force Microscope video. They would also like to thank Includes audio/video content: AV special element video. This course surveys techniques to fabricate and analyze submicron and nanometer structures, with applications. Optical and electron microscopy is reviewed. Additional topics that are covered include: surface characterization, preparation, and measurement techniques, resist technology, optical projection, interferometric, X-ray, ion, and electron lithography; Aqueous, ion, and plasma etching techniques; lift-off and electroplating; and ion implantation. Applications in microelectronics, microphotonics, information storage, and nanotechnology will also be explored.AcknowledgementsThe Instructors would like to thank Bob Barsotti, Bryan Cord, and Ben Wunsch for their work on the Atomic Force Microscope video. They would also like to thank

Subjects

submicron and nanometer structures | submicron and nanometer structures | optical and electron microscopy | optical and electron microscopy | Surface characterization | Surface characterization | preparation | preparation | and measurement techniques | and measurement techniques | Resist technology | Resist technology | optical projection | optical projection | interferometric | interferometric | X-ray | X-ray | ion | ion | and electron lithography | and electron lithography | Aqueous | Aqueous | and plasma etching techniques | and plasma etching techniques | Lift-off and electroplating | Lift-off and electroplating | Ion implantation | Ion implantation | microelectronics | microelectronics | microphotonics | microphotonics | information storage | information storage | and nanotechnology | and nanotechnology

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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4.131B Architectural Design, Level II: Material and Tectonic Transformations: The Herreshoff Museum (MIT) 4.131B Architectural Design, Level II: Material and Tectonic Transformations: The Herreshoff Museum (MIT)

Description

This semester students are asked to transform the Hereshoff Museum in Bristol, Rhode Island, through processes of erasure and addition. Hereshoff Manufacturing was recognized as one of the premier builders of America's Cup racing boats between 1890's and 1930's. The studio, however, is about more than the program. It is about land, water, and wind and the search for expressing materially and tectonically the relationships between these principle conditions. That is, where the land is primarily about stasis (docking, anchoring and referencing our locus), water's fluidity holds the latent promise of movement and freedom. Movement is activated by wind, allowing for negotiating the relationship between water and land. This semester students are asked to transform the Hereshoff Museum in Bristol, Rhode Island, through processes of erasure and addition. Hereshoff Manufacturing was recognized as one of the premier builders of America's Cup racing boats between 1890's and 1930's. The studio, however, is about more than the program. It is about land, water, and wind and the search for expressing materially and tectonically the relationships between these principle conditions. That is, where the land is primarily about stasis (docking, anchoring and referencing our locus), water's fluidity holds the latent promise of movement and freedom. Movement is activated by wind, allowing for negotiating the relationship between water and land.

Subjects

architecture | architecture | design | design | tectonics | tectonics | representation | representation | materials | materials | construction | construction | presentation | presentation | sketching | sketching | metaphor | metaphor | boat building | boat building | shipyard renovation | shipyard renovation | adaptive reuse | adaptive reuse | public and private space | public and private space | visual arts | visual arts | America's Cup | America's Cup | racing | racing | displacement | displacement | lightness | lightness | mass | mass | strength | strength | energy | energy | speed | speed | design studio | design studio | architectural design | architectural design | public space | public space | private space | private space | tectonic language | tectonic language | design process | design process | research | research | reading | reading | representing | representing | testing | testing

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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PE.730 Archery (MIT) PE.730 Archery (MIT)

Description

Includes audio/video content: AV special element video. This 12 session course is designed for the beginning or novice archer and uses recurve indoor target bows and equipment. The purpose of the course is to introduce students to the basic techniques of indoor target archery emphasizing the care and use of equipment, range safety, stance and shooting techniques, scoring and competition. Includes audio/video content: AV special element video. This 12 session course is designed for the beginning or novice archer and uses recurve indoor target bows and equipment. The purpose of the course is to introduce students to the basic techniques of indoor target archery emphasizing the care and use of equipment, range safety, stance and shooting techniques, scoring and competition.

Subjects

archery | archery | bow | bow | arrow | arrow | stringing | stringing | tourney | tourney | technique | technique | release | release | aim | aim | firing | firing | grouping | grouping | clusters | clusters | safety | safety | stretching | stretching | video | video | high speed video | high speed video | stance | stance | sighting | sighting | speed shooting | speed shooting | balance | balance | musculature | musculature | tournaments | tournaments | distance | distance | accuracy | accuracy

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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16.810 Engineering Design and Rapid Prototyping (MIT) 16.810 Engineering Design and Rapid Prototyping (MIT)

Description

Includes audio/video content: AV special element video. This course provides students with an opportunity to conceive, design and implement a product, using rapid prototyping methods and computer-aid tools. The first of two phases challenges each student team to meet a set of design requirements and constraints for a structural component. A course of iteration, fabrication, and validation completes this manual design cycle. During the second phase, each team conducts design optimization using structural analysis software, with their phase one prototype as a baseline. Acknowledgements This course is made possible thanks to a grant by the alumni sponsored Teaching and Education Enhancement Program (Class of '51 Fund for Excellence in Education, Class of '55 Fund for Excellence in Teachin Includes audio/video content: AV special element video. This course provides students with an opportunity to conceive, design and implement a product, using rapid prototyping methods and computer-aid tools. The first of two phases challenges each student team to meet a set of design requirements and constraints for a structural component. A course of iteration, fabrication, and validation completes this manual design cycle. During the second phase, each team conducts design optimization using structural analysis software, with their phase one prototype as a baseline. Acknowledgements This course is made possible thanks to a grant by the alumni sponsored Teaching and Education Enhancement Program (Class of '51 Fund for Excellence in Education, Class of '55 Fund for Excellence in Teachin

Subjects

engineering design | engineering design | rapid prototyping | rapid prototyping | manufacturing | manufacturing | testing | testing | system components | system components | complex structural parts | complex structural parts | hand sketching | hand sketching | CAD | CAD | CAD modeling | CAD modeling | CAE | CAE | CAE analysis | CAE analysis | CAM programming | CAM programming | CNC | CNC | CNC machining | CNC machining | computer aided design | computer aided design | computer aided | computer aided | structual testing | structual testing | multiobjective design | multiobjective design | optimization | optimization | computational methods | computational methods | tools | tools | design process | design process | design competition | design competition | active learning | active learning | hands-on | hands-on | human creativity | human creativity | holistic | holistic | solidworks | solidworks | finite element | finite element | FEM | FEM | FEM analysis | FEM analysis | COSMOS | COSMOS | omax | omax | presentation | presentation | CDIO | CDIO | structural testing | structural testing

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.774 Physics of Microfabrication: Front End Processing (MIT) 6.774 Physics of Microfabrication: Front End Processing (MIT)

Description

Includes audio/video content: AV lectures. This course is offered to graduates and focuses on understanding the fundamental principles of the "front-end" processes used in the fabrication of devices for silicon integrated circuits. This includes advanced physical models and practical aspects of major processes, such as oxidation, diffusion, ion implantation, and epitaxy. Other topics covered include: high performance MOS and bipolar devices including ultra-thin gate oxides, implant-damage enhanced diffusion, advanced metrology, and new materials such as Silicon Germanium (SiGe). Includes audio/video content: AV lectures. This course is offered to graduates and focuses on understanding the fundamental principles of the "front-end" processes used in the fabrication of devices for silicon integrated circuits. This includes advanced physical models and practical aspects of major processes, such as oxidation, diffusion, ion implantation, and epitaxy. Other topics covered include: high performance MOS and bipolar devices including ultra-thin gate oxides, implant-damage enhanced diffusion, advanced metrology, and new materials such as Silicon Germanium (SiGe).

Subjects

fabrication processes | fabrication processes | silicon | silicon | integrated circuits | integrated circuits | monolithic integrated circuits | monolithic integrated circuits | physical models | physical models | bulk crystal growth | bulk crystal growth | thermal oxidation | thermal oxidation | solid-state diffusion | solid-state diffusion | ion implantation | ion implantation | epitaxial deposition | epitaxial deposition | chemical vapor deposition | chemical vapor deposition | physical vapor deposition | physical vapor deposition | refractory metal silicides | refractory metal silicides | plasma and reactive ion etching | plasma and reactive ion etching | rapid thermal processing | rapid thermal processing | process modeling | process modeling | process simulation | process simulation | technological limitations | technological limitations | integrated circuit design | integrated circuit design | integrated circuit fabrication | integrated circuit fabrication | device operation | device operation | sige materials | sige materials | processing | processing

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.152J Micro/Nano Processing Technology (MIT) 6.152J Micro/Nano Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology. This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | microelectronics | Microelectronics processing | Microelectronics processing | integrated circuits | integrated circuits | vacuum | vacuum | chemical vapor deposition | chemical vapor deposition | CVD | CVD | oxidation | oxidation | diffusion | diffusion | implantation | implantation | lithography | lithography | soft lithography | soft lithography | etching | etching | sputtering | sputtering | evaporation | evaporation | interconnect | interconnect | metallization | metallization | crystal growth | crystal growth | reliability | reliability | fabrication | fabrication | processing | processing | photolithography | photolithography | physical vapor deposition | physical vapor deposition | MOS | MOS | MOS capacitor | MOS capacitor | microcantilever | microcantilever | microfluidic. | microfluidic.

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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16.810 Engineering Design and Rapid Prototyping (MIT) 16.810 Engineering Design and Rapid Prototyping (MIT)

Description

This course provides students with an opportunity to conceive, design and implement a product, using rapid protyping methods and computer-aid tools. The first of two phases challenges each student team to meet a set of design requirements and constraints for a structural component. A course of iteration, fabrication, and validation completes this manual design cycle. During the second phase, each team conducts design optimization using structural analysis software, with their phase one prototype as a baseline.AcknowledgmentsThis course is made possible thanks to a grant by the alumni sponsored Teaching and Education Enhancement Program (Class of '51 Fund for Excellence in Education, Class of '55 Fund for Excellence in Teaching, Class of '72 Fund for Educationa This course provides students with an opportunity to conceive, design and implement a product, using rapid protyping methods and computer-aid tools. The first of two phases challenges each student team to meet a set of design requirements and constraints for a structural component. A course of iteration, fabrication, and validation completes this manual design cycle. During the second phase, each team conducts design optimization using structural analysis software, with their phase one prototype as a baseline.AcknowledgmentsThis course is made possible thanks to a grant by the alumni sponsored Teaching and Education Enhancement Program (Class of '51 Fund for Excellence in Education, Class of '55 Fund for Excellence in Teaching, Class of '72 Fund for Educationa

Subjects

engineering design | engineering design | rapid prototyping | rapid prototyping | manufacturing | manufacturing | testing | testing | system components | system components | complex structural parts | complex structural parts | hand sketching | hand sketching | CAD | CAD | CAD modeling | CAD modeling | CAE | CAE | CAE analysis | CAE analysis | CAM programming | CAM programming | CNC | CNC | CNC machining | CNC machining | computer aided design | computer aided design | computer aided | computer aided | structual testing | structual testing | multiobjective design | multiobjective design | optimization | optimization | computational methods | computational methods | tools | tools | design process | design process | design competition | design competition | active learning | active learning | hands-on | hands-on | human creativity | human creativity | holistic | holistic | solidworks | solidworks | finite element | finite element | FEM | FEM | FEM analysis | FEM analysis | COSMOS | COSMOS | omax | omax | presentation | presentation | CDIO | CDIO

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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16.682 Prototyping Avionics (MIT) 16.682 Prototyping Avionics (MIT)

Description

In the past building prototypes of electronic components for new projects/products was limited to using protoboards and wirewrap. Manufacturing a printed-circuit-board was limited to final production, where mistakes in the implementation meant physically cutting traces on the board and adding wire jumpers - the final products would have these fixes on them! Today that is no longer the case, while you will still cut traces and use jumpers when debugging a board, manufacturing a new final version without the errors is a simple and relatively inexpensive task. For that matter, manufacturing a prototype printed circuit board which you know is likely to have errors but which will get the design substantially closer to the final product than a protoboard setup is not only possible, but desirable In the past building prototypes of electronic components for new projects/products was limited to using protoboards and wirewrap. Manufacturing a printed-circuit-board was limited to final production, where mistakes in the implementation meant physically cutting traces on the board and adding wire jumpers - the final products would have these fixes on them! Today that is no longer the case, while you will still cut traces and use jumpers when debugging a board, manufacturing a new final version without the errors is a simple and relatively inexpensive task. For that matter, manufacturing a prototype printed circuit board which you know is likely to have errors but which will get the design substantially closer to the final product than a protoboard setup is not only possible, but desirable

Subjects

engineering design | engineering design | rapid prototyping | rapid prototyping | manufacturing | manufacturing | testing | testing | system components | system components | complex structural parts | complex structural parts | hand sketching | hand sketching | CAD | CAD | CAD modeling | CAD modeling | CAE | CAE | CAE analysis | CAE analysis | CAM programming | CAM programming | CNC | CNC | CNC machining | CNC machining | computer aided design | computer aided design | computer aided | computer aided | structual testing | structual testing | multiobjective design | multiobjective design | optimization | optimization | computational methods | computational methods | tools | tools | design process | design process | design competition | design competition | active learning | active learning | hands-on | hands-on | human creativity | human creativity | holistic | holistic | solidworks | solidworks | finite element | finite element | FEM | FEM | FEM analysis | FEM analysis | COSMOS | COSMOS | omax | omax | presentation | presentation | CDIO | CDIO

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.152J Micro/Nano Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic.

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.152J Micro/Nano Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic.

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.152J Micro/Nano Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic.

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.781J Submicrometer and Nanometer Technology (MIT)

Description

This course surveys techniques to fabricate and analyze submicron and nanometer structures, with applications. Optical and electron microscopy is reviewed. Additional topics that are covered include: surface characterization, preparation, and measurement techniques, resist technology, optical projection, interferometric, X-ray, ion, and electron lithography; Aqueous, ion, and plasma etching techniques; lift-off and electroplating; and ion implantation. Applications in microelectronics, microphotonics, information storage, and nanotechnology will also be explored.AcknowledgementsThe Instructors would like to thank Bob Barsotti, Bryan Cord, and Ben Wunsch for their work on the Atomic Force Microscope video. They would also like to thank Bryan Cord for creating each video.

Subjects

submicron and nanometer structures | optical and electron microscopy | Surface characterization | preparation | and measurement techniques | Resist technology | optical projection | interferometric | X-ray | ion | and electron lithography | Aqueous | and plasma etching techniques | Lift-off and electroplating | Ion implantation | microelectronics | microphotonics | information storage | and nanotechnology

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see https://ocw.mit.edu/terms/index.htm

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UCL Art Museum: 'Portrait Highlights Teaching Pack

Description

This resource contains a selection of 50 high-resolution portraits from UCL Art Museum’s collections, highlighting the range of techniques, time periods, sitters and artists represented in the collections, with an emphasis on professors and students at the Slade School of Fine Art. This resource has been uploaded as a web site zip file to be used within a browser (once unzipped, navigate to the index.html file in the folder to run the resource) and as a .elp file (allowing modification in eXe content packaging software, in addition to subsequent packaging in the desired format, e.g., IMS Content Package, Web Pages). This resource has been created as part of the JISC funded project Object Based Learning for Higher Education (OBL4HE) - a project to create a range of online educational reso

Subjects

etching | engraving | chalk | woodcut | pen | ink | mezzotint | drypoint | lithograph | pencil | oil | cream wove paper | paper | pastel | Anthony van Dyck | Rembrandt | Henry Tonks | canvas | board | OBL4HE

License

Attribution-Noncommercial-Share Alike 2.0 UK: England & Wales Attribution-Noncommercial-Share Alike 2.0 UK: England & Wales http://creativecommons.org/licenses/by-nc-sa/2.0/uk/ http://creativecommons.org/licenses/by-nc-sa/2.0/uk/

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6.152J Micro/Nano Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic.

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.152J Micro/Nano Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic.

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.152J Micro/Nano Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic.

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.152J Micro/Nano Processing Technology (MIT)

Description

This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.

Subjects

microelectronics | Microelectronics processing | integrated circuits | vacuum | chemical vapor deposition | CVD | oxidation | diffusion | implantation | lithography | soft lithography | etching | sputtering | evaporation | interconnect | metallization | crystal growth | reliability | fabrication | processing | photolithography | physical vapor deposition | MOS | MOS capacitor | microcantilever | microfluidic.

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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