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6.774 Physics of Microfabrication: Front End Processing (MIT) 6.774 Physics of Microfabrication: Front End Processing (MIT)

Description

Includes audio/video content: AV lectures. This course is offered to graduates and focuses on understanding the fundamental principles of the "front-end" processes used in the fabrication of devices for silicon integrated circuits. This includes advanced physical models and practical aspects of major processes, such as oxidation, diffusion, ion implantation, and epitaxy. Other topics covered include: high performance MOS and bipolar devices including ultra-thin gate oxides, implant-damage enhanced diffusion, advanced metrology, and new materials such as Silicon Germanium (SiGe). Includes audio/video content: AV lectures. This course is offered to graduates and focuses on understanding the fundamental principles of the "front-end" processes used in the fabrication of devices for silicon integrated circuits. This includes advanced physical models and practical aspects of major processes, such as oxidation, diffusion, ion implantation, and epitaxy. Other topics covered include: high performance MOS and bipolar devices including ultra-thin gate oxides, implant-damage enhanced diffusion, advanced metrology, and new materials such as Silicon Germanium (SiGe).

Subjects

fabrication processes | fabrication processes | silicon | silicon | integrated circuits | integrated circuits | monolithic integrated circuits | monolithic integrated circuits | physical models | physical models | bulk crystal growth | bulk crystal growth | thermal oxidation | thermal oxidation | solid-state diffusion | solid-state diffusion | ion implantation | ion implantation | epitaxial deposition | epitaxial deposition | chemical vapor deposition | chemical vapor deposition | physical vapor deposition | physical vapor deposition | refractory metal silicides | refractory metal silicides | plasma and reactive ion etching | plasma and reactive ion etching | rapid thermal processing | rapid thermal processing | process modeling | process modeling | process simulation | process simulation | technological limitations | technological limitations | integrated circuit design | integrated circuit design | integrated circuit fabrication | integrated circuit fabrication | device operation | device operation | sige materials | sige materials | processing | processing

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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2.76 Multi-Scale System Design (MIT) 2.76 Multi-Scale System Design (MIT)

Description

Multi-scale systems (MuSS) consist of components from two or more length scales (nano, micro, meso, or macro-scales). In MuSS, the engineering modeling, design principles, and fabrication processes of the components are fundamentally different. The challenge is to make these components so they are conceptually and model-wise compatible with other-scale components with which they interface. This course covers the fundamental properties of scales, design theories, modeling methods and manufacturing issues which must be addressed in these systems. Examples of MuSS include precision instruments, nanomanipulators, fiber optics, micro/nano-photonics, nanorobotics, MEMS (piezoelectric driven manipulators and optics), X-Ray telescopes and carbon nano-tube assemblies. Students master the materials Multi-scale systems (MuSS) consist of components from two or more length scales (nano, micro, meso, or macro-scales). In MuSS, the engineering modeling, design principles, and fabrication processes of the components are fundamentally different. The challenge is to make these components so they are conceptually and model-wise compatible with other-scale components with which they interface. This course covers the fundamental properties of scales, design theories, modeling methods and manufacturing issues which must be addressed in these systems. Examples of MuSS include precision instruments, nanomanipulators, fiber optics, micro/nano-photonics, nanorobotics, MEMS (piezoelectric driven manipulators and optics), X-Ray telescopes and carbon nano-tube assemblies. Students master the materials

Subjects

scale | scale | complexity | complexity | nano | micro | meso | or macro-scale | nano | micro | meso | or macro-scale | kinematics | kinematics | metrology | metrology | engineering modeling | motion | engineering modeling | motion | modeling | modeling | design | design | manufacture | manufacture | design principles | design principles | fabrication process | fabrication process | functional requirements | functional requirements | precision instruments | precision instruments | nanomanipulators | fiber optics | micro- photonics | nano-photonics | nanorobotics | MEMS | nanomanipulators | fiber optics | micro- photonics | nano-photonics | nanorobotics | MEMS | piezoelectric | transducer | actuator | sensor | piezoelectric | transducer | actuator | sensor | constraint | rigid constraint | flexible constraint | ride-flexible constraint | constraint | rigid constraint | flexible constraint | ride-flexible constraint | constaint-based design | constaint-based design | carbon nanotube | carbon nanotube | nanowire | nanowire | scanning tunneling microscope | scanning tunneling microscope | flexure | flexure | protein structure | protein structure | polymer structure | polymer structure | nanopelleting | nanopipette | nanowire | nanopelleting | nanopipette | nanowire | TMA pixel array | TMA pixel array | error modeling | error modeling | repeatability | repeatability

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.777J Design and Fabrication of Microelectromechanical Devices (MIT) 6.777J Design and Fabrication of Microelectromechanical Devices (MIT)

Description

6.777J / 2.372J is an introduction to microsystem design. Topics covered include: material properties, microfabrication technologies, structural behavior, sensing methods, fluid flow, microscale transport, noise, and amplifiers feedback systems. Student teams design microsystems (sensors, actuators, and sensing/control systems) of a variety of types, (e.g., optical MEMS, bioMEMS, inertial sensors) to meet a set of performance specifications (e.g., sensitivity, signal-to-noise) using a realistic microfabrication process. There is an emphasis on modeling and simulation in the design process. Prior fabrication experience is desirable. The course is worth 4 Engineering Design Points. 6.777J / 2.372J is an introduction to microsystem design. Topics covered include: material properties, microfabrication technologies, structural behavior, sensing methods, fluid flow, microscale transport, noise, and amplifiers feedback systems. Student teams design microsystems (sensors, actuators, and sensing/control systems) of a variety of types, (e.g., optical MEMS, bioMEMS, inertial sensors) to meet a set of performance specifications (e.g., sensitivity, signal-to-noise) using a realistic microfabrication process. There is an emphasis on modeling and simulation in the design process. Prior fabrication experience is desirable. The course is worth 4 Engineering Design Points.

Subjects

microsystem design | microsystem design | material properties | material properties | microfabrication technologies | microfabrication technologies | structural behavior | structural behavior | sensing methods | sensing methods | fluid flow | fluid flow | microscale transport | microscale transport | noise | noise | amplifiers feedback systems | amplifiers feedback systems | sensors | sensors | actuators | actuators | sensing/control systems | sensing/control systems | optical MEMS | optical MEMS | bioMEMS | bioMEMS | inertial sensors | inertial sensors | sensitivity | sensitivity | signal-to-noise | signal-to-noise | realistic microfabrication process | realistic microfabrication process

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see http://ocw.mit.edu/terms/index.htm

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6.774 Physics of Microfabrication: Front End Processing (MIT)

Description

This course is offered to graduates and focuses on understanding the fundamental principles of the "front-end" processes used in the fabrication of devices for silicon integrated circuits. This includes advanced physical models and practical aspects of major processes, such as oxidation, diffusion, ion implantation, and epitaxy. Other topics covered include: high performance MOS and bipolar devices including ultra-thin gate oxides, implant-damage enhanced diffusion, advanced metrology, and new materials such as Silicon Germanium (SiGe).

Subjects

fabrication processes | silicon | integrated circuits | monolithic integrated circuits | physical models | bulk crystal growth | thermal oxidation | solid-state diffusion | ion implantation | epitaxial deposition | chemical vapor deposition | physical vapor deposition | refractory metal silicides | plasma and reactive ion etching | rapid thermal processing | process modeling | process simulation | technological limitations | integrated circuit design | integrated circuit fabrication | device operation | sige materials | processing

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see https://ocw.mit.edu/terms/index.htm

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DG5134 Printed Circuit Board Design, Manufacture and Test

Description

Electronic and electrical modules and subsystems consist of interconnected components which perform tasks and action to meet the aims of the systems of which they form a part. Many of these systems are familiar to us, for example allowing us to switch on and control a television, withdraw money from an automated teller machine (ATM) or display a document like this one on a computer. You can probably think of some other systems we use. Printed circuit boards (PCBs) are the most common means by which these electronic circuits and systems are constructed. In this unit you will learn about the basic techniques involved in PCB design, manufacture and test, and you will also have the opportunity to practice the skills required to produce a PCB. Outcomes 1. Use an electronic design software packa

Subjects

DG51 34 | Axial component factors | PCB fabrication | Typical low-volume fabrication process | Electrostatic discharge | Automated soldering processes | Reflow soldering | Infrared reflow | convection reflow | Vapour-phase reflow | Manual soldering | X: Engineering | MANUFACTURING / PRODUCTION WORK | SCQF Level 7

License

Except where expressly indicated otherwise on the face of these materials (i) copyright in these materials is owned by the Scottish Qualification Authority (SQA), and (ii) none of these materials may be Used without the express, prior, written consent of the Colleges Open Learning Exchange Group (COLEG) and SQA, except if and to the extent that such Use is permitted under COLEG's conditions of Contribution and Use of Learning Materials through COLEG’s Repository, for the purposes of which these materials are COLEG Materials. Except where expressly indicated otherwise on the face of these materials (i) copyright in these materials is owned by the Scottish Qualification Authority (SQA), and (ii) none of these materials may be Used without the express, prior, written consent of the Colleges Open Learning Exchange Group (COLEG) and SQA, except if and to the extent that such Use is permitted under COLEG's conditions of Contribution and Use of Learning Materials through COLEG’s Repository, for the purposes of which these materials are COLEG Materials. Licensed to colleges in Scotland only Licensed to colleges in Scotland only http://content.resourceshare.ac.uk/xmlui/bitstream/handle/10949/17761/LicenceSQAMaterialsCOLEG.pdf?sequence=1 http://content.resourceshare.ac.uk/xmlui/bitstream/handle/10949/17761/LicenceSQAMaterialsCOLEG.pdf?sequence=1 SQA SQA

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2.76 Multi-Scale System Design (MIT)

Description

Multi-scale systems (MuSS) consist of components from two or more length scales (nano, micro, meso, or macro-scales). In MuSS, the engineering modeling, design principles, and fabrication processes of the components are fundamentally different. The challenge is to make these components so they are conceptually and model-wise compatible with other-scale components with which they interface. This course covers the fundamental properties of scales, design theories, modeling methods and manufacturing issues which must be addressed in these systems. Examples of MuSS include precision instruments, nanomanipulators, fiber optics, micro/nano-photonics, nanorobotics, MEMS (piezoelectric driven manipulators and optics), X-Ray telescopes and carbon nano-tube assemblies. Students master the materials

Subjects

scale | complexity | nano | micro | meso | or macro-scale | kinematics | metrology | engineering modeling | motion | modeling | design | manufacture | design principles | fabrication process | functional requirements | precision instruments | nanomanipulators | fiber optics | micro- photonics | nano-photonics | nanorobotics | MEMS | piezoelectric | transducer | actuator | sensor | constraint | rigid constraint | flexible constraint | ride-flexible constraint | constaint-based design | carbon nanotube | nanowire | scanning tunneling microscope | flexure | protein structure | polymer structure | nanopelleting | nanopipette | nanowire | TMA pixel array | error modeling | repeatability

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see https://ocw.mit.edu/terms/index.htm

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6.777J Design and Fabrication of Microelectromechanical Devices (MIT)

Description

6.777J / 2.372J is an introduction to microsystem design. Topics covered include: material properties, microfabrication technologies, structural behavior, sensing methods, fluid flow, microscale transport, noise, and amplifiers feedback systems. Student teams design microsystems (sensors, actuators, and sensing/control systems) of a variety of types, (e.g., optical MEMS, bioMEMS, inertial sensors) to meet a set of performance specifications (e.g., sensitivity, signal-to-noise) using a realistic microfabrication process. There is an emphasis on modeling and simulation in the design process. Prior fabrication experience is desirable. The course is worth 4 Engineering Design Points.

Subjects

microsystem design | material properties | microfabrication technologies | structural behavior | sensing methods | fluid flow | microscale transport | noise | amplifiers feedback systems | sensors | actuators | sensing/control systems | optical MEMS | bioMEMS | inertial sensors | sensitivity | signal-to-noise | realistic microfabrication process

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see https://ocw.mit.edu/terms/index.htm

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6.774 Physics of Microfabrication: Front End Processing (MIT)

Description

This course is offered to graduates and focuses on understanding the fundamental principles of the "front-end" processes used in the fabrication of devices for silicon integrated circuits. This includes advanced physical models and practical aspects of major processes, such as oxidation, diffusion, ion implantation, and epitaxy. Other topics covered include: high performance MOS and bipolar devices including ultra-thin gate oxides, implant-damage enhanced diffusion, advanced metrology, and new materials such as Silicon Germanium (SiGe).

Subjects

fabrication processes | silicon | integrated circuits | monolithic integrated circuits | physical models | bulk crystal growth | thermal oxidation | solid-state diffusion | ion implantation | epitaxial deposition | chemical vapor deposition | physical vapor deposition | refractory metal silicides | plasma and reactive ion etching | rapid thermal processing | process modeling | process simulation | technological limitations | integrated circuit design | integrated circuit fabrication | device operation | sige materials | processing

License

Content within individual OCW courses is (c) by the individual authors unless otherwise noted. MIT OpenCourseWare materials are licensed by the Massachusetts Institute of Technology under a Creative Commons License (Attribution-NonCommercial-ShareAlike). For further information see https://ocw.mit.edu/terms/index.htm

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